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Solder Paste SP2100

The SP2100 solder paste has been developed for high volume, lead-free SMD electronics manufacturing. This solder paste contains a highly active type L1 No-Clean flux, the activation is slightly stronger compared to the solder paste SP2200. With a special formula for excellent wetting, it meets the wetting requirements on surfaces found in any volume production today. Even poorly solderable surfaces are excellently wetted for a No-Clean solder paste system. The small amounts of residue after reflow are bright, transparent, electrically safe and do not need to be removed.
Solder Paste SP2100

Product Advantages

  • especially developed for use with lead-free alloys
  • very good printing after long printer downtime
  • for surfaces with poor wettability
  • reflow possible under air or nitrogen
  • high wet bonding strength for use on high speed mounting systems
  • high open time of the printed circuit board

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