for every application
for every application
Our Product Selector – how to find the right solder paste
Stannol manufactures leaded and lead-free solder pastes in various alloys, grain sizes and units for a wide range of applications. Specially developed for lead-free use, we offer silver-containing, silver-reduced and silver-free solder pastes.
To give you a better overview, we have developed our innovative product selector. This offers you an initial overview of our most important solder pastes.
First define your specific area of application in the "Selector Guide" section. Then you can specify the desired alloy and the appropriate flux properties. Afterwards, the product overview will show you which solder paste is best suited for your area of application.
Our solder pastes are available as standard units in 500 g cans, 6 oz cartridges and 12 oz cartridges – we are happy to help you find the right product.
Lead-free solder paste
The No-Clean solder paste SP2200 was developed for use with lead-free alloys in stencil printing. Besides the long open time, this paste shows excellent print results in the initial print, even after longer interruptions. The No-Clean solder paste SP2200 is activated according to L0. This activation level provides good wetting on all surfaces used in today's electronics while maintaining high electrical safety of the residues. The small amounts of residue after the reflow process are clearly transparent and do not need to be removed. The SP2200 is also available as greenconnect version.
Lead-containing solder paste
The solder paste SP1200 is only available in leaded alloys. It was developed for lead-containing alloys with Sn62Pb36Ag2 as a standard alloy. It contains a highly active type L No-Clean flux. With a special formulation for perfect wetting, the SP1200 fulfils all the requirements for a modern solder paste, which can be used in high volume electronics manufacturing. Wetting properties have been optimised for all known surfaces used in the electronics industry. As this solder paste leaves only very small amounts of residues on the PCB after soldering and these residues show exceptional electrical safety, there is no need for cleaning.
Dispensable solder paste
For automatic dispensing processes we offer the SP2300D solder paste. This has been developed for use with the alloy TSC305 (Sn96.5Ag3Cu0.5) as standard alloy. SP2300D contains a highly active type L No-Clean flux. With a special formula for excellent wetting, the solder paste meets the requirements of high volume production. Wetting properties have been optimised for all known lead-free PCB and component coatings. The small amounts of residue after reflow are electrically safe and do not need to be removed.
Ideal soldering profiles
Newly developed solder pastes can often be easily integrated into existing processes. Nevertheless, depending on the PCB and component configuration, it may be necessary to make minor changes in the temperature profile to achieve the desired performance of the flux. As a good starting point, the middle of the process window at 25 °C for 40 to 60 seconds above the melting point (liquidus) can be satisfactory and, for the most part, gentle on the component.
For special requirements, for example in vapour phase systems, with critical components or demanding PCB designs, an accelerated linear profile can also be useful. Please contact us for optimisation – our experienced application engineers will be happy to support you.
We are happy to support you
If you need advice on which product is right for you, please contact us.
You can find more information about our sustainable greenconnect range in our greenconnect catalogue.