The halogen-free activated No-Clean flux EF350 Bio guarantees an excellent wetting ability on different surfaces (for example OSP, Ni/Au, HAL, chem. Sn and chem. Ag) with both lead-free and lead-containing solder alloys.

The EF350 Bio is universally applicable – it can be used in wave soldering as well as selective soldering. The EF350 Bio is well suited for use in spray fluxers.

The use of bio-ethanol reduces the carbon fooprint compared to conventional alcohol-based fluxes. Important for our customers: Extensive tests have proven that a 1:1 exchange of the flux is possible without changing the process parameters.

WF130 and WF131 are developments of water-based ORL0 fluxes. Both deliver perfect soldering results and leave very low amounts of electrically harmless residues in combination with an extremely low corrosion potential. These two water-based fluxes are halogen-free and contain no VOCs. Due to the very low corrosive potential, both can be classified as L0, which is not often possible with water-based fluxes.

The main difference of WF131 is a further reduction in residue levels, with the small trade-off of a slightly smaller process window. The introduction of water-based fluxes often requires a comprehensive evaluation of current equipment technology and application. Our team will be happy to support you in this process and provide competent advice on site.

Stannol soldering flux SF1000 Bio was especially developed for selective soldering of electronic assemblies. The low solids
content in combination with specially tailored halogen-free activation results in excellent wetting ability on a wide variety of
surfaces (e.g. OSP, Ni/Au, HAL), even with lead-free soldering alloys. This flux can also be used for other soldering processes
such as wave and dip soldering. Compared to conventional alcohol-based fluxes, the carbon footprint is reduced.

Today, the electronics manufacturing industry places very high demands on modern flux systems. The products of our EF series meet these requirements, not least due to their great variety and wide range of applications. A large part of the series, for example, was developed specifically for application with modern spray flux systems.

EF fluxes are offered in different levels of activation. This means that the ideal activation can be selected for each process – depending on the requirements for solderability and reliability. For full tunnel nitrogen systems, for example, a very low activation can be considered. For soldering on older systems and on surfaces that are difficult to solder, on the other hand, a higher activation should be used.

The reliability of the No-Clean fluxes and their residues after soldering also play an essential part in selecting the right flux. Thus, within the completely halogen-free EF series, fluxes can be found both with and without resin or with the smallest amounts of activator up to very broadband fluxes. Thus, all requirements of current electronics manufacturing can be covered. The EF fluxes have in common that a high to very high electrical safety is guaranteed with varying small residue quantities on the soldered PCBs.

In direct comparison to the flux EF330, the flux EF350 increases the insulation resistance of the flux residues due to a low addition of resins and at the same time reduces the formation of solder beads. The EF200 series fluxes are weaker activated and show their strengths in full tunnel nitrogen systems, as they leave less residue on the PCB due to their lower solids content. The EF270F flux is the optimised variant for application by foam fluxer. It is characterised above all by a fine-pored foam crown.

When developing the EF250 flux, the most important criterion was to minimise contamination by the flux. Using EF250 not only reduces the amount of cleaning required in the system, but also the residues on the assembly itself – while at the same time ensuring reliable wetting and complying with common test criteria for electrical safety.

Often, the water-based fluxes cannot be processed satisfactorily on some older soldering systems because the preheating is too short or too weak. In order to still significantly reduce the proportion of VOC emissions, fluxes can be used whose solvent is a mixture of water and alcohols. This group of fluxes is characterised by lower flash points and a 50 percent reduction in VOC content compared to alcohol-based fluxes. They are also free of resins and halogens.

The semi-aqueous flux HW139 with 2.5 wt.% solids has already proven itself for many years in different soldering tasks. It is also easy to apply by means of a spray fluxer. As a newer development, HW240 ensures good soldering results with the same high soldering quality and wetting ability. At the same time, residue levels are greatly reduced due to a unique activator combination.