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Solder Paste SP1200

The solder paste SP1200 has been developed for leaded SMD electronics manufacturing and contains a highly active type ROL1 No-Clean flux. With a special composition for excellent wetting, this solder paste meets all requirements for good solder joint formation. Especially on poorly solderable surfaces, SP2100 can show its strengths. The small amounts of residue after reflow are bright, transparent, electrically safe and do not need to be removed.
Solder Paste SP1200

Product Advantages

  • broadband solder paste with large process window
  • very good printing long printer downtime
  • very suitable for surfaces with poor wettability
  • reflow possible under air or nitrogen
  • high wet bonding strength for use on high-speed mounting systems

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