Tin solder – Flowtin TC300
Flowtin TC300 (Sn97Cu3) is a lead-free solder analogous to ISO 9453 (alloy number 402) with micro-alloyed additives (<0.1%).
The alloy is manufactured from pure metals and has been developed to minimise the disadvantages with lead-free high-temperature soldering of conventional lead-free tin/copper alloys regarding dissolution of metals and impurities resulting from these and to guarantee a stable, lead-free soldering process.
- good wetting behaviour
- melting range of 227 to 310 °C
- fine-grained and smooth surface
- reduced dissolution rate in comparison with conventional SnCu alloys and as a result significantly increased service lives of the solder baths
- longer contact times possible
The use of Flowtin TC300 as a wave solder requires a solder bath temperature of 350 °C. Here, there is a risk that due to the high dissolution rate of copper, the liquidus temperature of the solder is greatly increased and that thin wires and layers are dissolved in a short time. Flowtin TC300 reduces the dissolution rate and thus prevents the reduction of the Cu cross-section of the wire. If dross is a problem, lead-free deoxidising pellets can be added to keep the surface bright. The use of inert gas means a significant extension of the process window. The wetting of the solder is improved and no excess solder remains on the components when exiting the wave. Furthermore, dross formation is considerably minimised. Flowtin TC300 can also be used in selective soldering systems.
Available Delivery Forms
- Triangular bar, extruded
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