It is a recurring task in electronics manufacture that minimal quantities of flux must be applied for certain soldering tasks to be able to make a reliable solder joint.
Our flux pens are an easy method for applying fluxes in difficult to access places. Ideal for rework, repairs and subsequent mounting of SMD components on densely populated circuit boards. The flux pens are reliable, quick, easy to use and cost-effective.
Flux gels for rework and repairs are usually developed and designated as No-Clean products. They mainly have the same chemical characteristics as flux media in soldering pastes. There is a wide variety of flux gels for different applications.
The Flux-Gel HX21 is a well-activated flux gel for soft soldering of metals which cannot be soldered with usual No-Clean fluxes. The application area is electronics manufacture as well as resoldering or repair work.
Suitable soldering methods are piston and bar soldering and hot air (nitrogen) and reflow.
Kolopaste No. 8 is suitable for repair soldering in SMT and for piston and bar soldering. The large-area soldering of copper, brass and pre-tinned parts is also possible. The extremely low, halogen-free activation causes very good insulation behaviour of the flux residues after the soldering.
Flux-Gel RMA04 is a ready to use thickened rosin (colophony) flux with high solid content in paste form for soldering copper, brass and tinned surfaces. The flux paste has very high adhesive strength and can also hold larger components during the reflow soldering. Therefore, it is outstandingly suitable for repair soldering for SMD components.
The Flux-Gel Multifix 450-01 has been specially developed for rework and repairs in the electronics industry. The flux gel is suitable both for manual application as well as for automatic application using a dispenser.
The task of reliably removing flux residues left behind often occurs in electronics manufacturing. The cleaning pen can be used where cleaning of complete circuit boards is not desirable.
This cleaning pen provides an easy to use method for removing flux residues from difficult to access places. It is ideal for use after rework, repairs and subsequent mounting of SMD components. These disposable pens are reliable, quick, easy to use and cost-effective.
The Solder-Ex desoldering wick has been developed for the repair of solder joints. It consists of copper wick and is coated with a special halogen-free flux which accelerates the solder absorption. Solder-Ex desoldering wicks are available in 4 widths for the various application areas.
The No-Clean desoldering wick has been developed for reliable desoldering and the repair of solder joints without having to be cleaned afterwards. The No-Clean desoldering wick is coated with a special halogen-free No-Clean flux which accelerates the solder absorption rate. Storage in a humid environment does not adversely affect this characteristic. The wick remains flexible and does not oxidise.