Stannol presents the new no-clean low-temperature solder paste SP6000 TBS04, which has been specially developed for applications with reduced peak temperatures in the reflow process, such as in LED technology or optoelectronics. The solder paste is based on the alloy Bi57.6Sn42Ag0.4 and combines technical performance and sustainability.

Product features at a glance

• Low melting range (~140 °C): ideal for temperature-sensitive components with a maximum reflow temperature of just 170-180 °C
• Solder powder made from recycled material: around 85% CO₂ savings
• Reduced system wear and energy consumption thanks to lower process temperatures
• High long-term reliability thanks to 0.4% silver content, more durable than pure BiSn alloys
• Suitable for fine-pitch applications up to 0.4 mm and miniature components
• Good press-on behaviour even after longer printing breaks
• Flexible use in reflow processes under air or nitrogen
• Very good wetting properties on common surfaces
• RoHS-compliant

The solder paste SP6000 TBS04 is also available as a dispensable version on request.

About Stannol GmbH & Co. KG

Stannol can look back on a long tradition in solder production: the company has been combining experience and progress in its products for over 140 years. To this day, Stannol is regarded as a pioneer of modern soldering technology and is firmly established on the market as a brand. The company specialises in the manufacture of solder wires, solder pastes, fluxes and bar solders. The product range also includes measuring and testing devices, cleaners, protective lacquers and other accessories. In addition to its high quality standards, Stannol is committed to sustainable and ecological production: Under the name greenconnect, the company offers a complete product range that focuses on sustainability and fairness. The greenconnect series has already won several awards.