With the SP6000 TBS04, Stannol presents an innovative no-clean LMPA solder paste that has been specially developed for applications with reduced peak temperatures in the reflow process, such as in the field of LED technology or optoelectronics.
Based on the alloy Bi57.6Sn42Ag0.4, the BSA solder paste combines technical performance and sustainability in one product.
The advantages at a glance
- Low melting range (~140 °C): ideal for temperature-sensitive components – with a maximum reflow temperature of just 170-180 °C
- Solder powder made from recycled material: for over 85 percent CO₂ savings – sustainable soldering has never been so easy
- Lower system wear & energy consumption: reduced process temperature measurably reduces your operating costs
- High long-term reliability: significantly more durable than pure BiSn alloys thanks to silver content (0.4 %)
- Fine precision: suitable for fine-pitch applications down to 0.4 mm – perfect results even with miniature components
- Process stability: very good press-on behaviour even after longer printing pauses
- Flexible use in the reflow process: under air or nitrogen
- Excellent wetting properties: can be used on a wide range of common surfaces
- Naturally RoHS-compliant
The BSA solder paste SP6000 TBS04 is also available as a dispensable version on request.