HOW TO FIND THE RIGHT SOLDER PASTE

For versatile applications and fields of use, Stannol manufactures lead-containing and lead-free solder pastes in various alloys, grain sizes and packages. Specially developed for lead-free use, we offer silver-containing, silver-reduced and silver-free solder pastes.

Stannol Product Selector

The Selector Guide on the left gives you the chance to choose different characteristics and to find a product from our range. If you are not familiar with some of the terms, you can use the information box to display a brief explanation of the selected item.

Selector Guide

Product Overview

Lead Containing

<p>The No-Clean solder pastes SP2100 and SP2200 are developed for use with lead-free alloys in stencil printing. In addition to the long open time, even after long printer down times, both pastes immediately show a perfect print definition.</p><p>Due to activation as a type L1 flux, SP2100 solder paste is more suitable for use on surfaces that are difficult to solder. This paste achieves good wetting and soldering results.</p><p>The No-Clean SP2200 solder paste, by contrast, is activated as type L0. This activation ensures good wetting combined with a high level of electrical safety on all surfaces used in electronics today. Both solder pastes leave only small amounts of residues after the reflow process, which are bright and transparent and do not have to be removed.</p>

LEAD-FREE SOLDER PASTES

The No-Clean solder pastes SP2100 and SP2200 are developed for use with lead-free alloys in stencil printing. In addition to the long open time, even after long printer down times, both pastes immediately show a perfect print definition.

Due to activation as a type L1 flux, SP2100 solder paste is more suitable for use on surfaces that are difficult to solder. This paste achieves good wetting and soldering results.

The No-Clean SP2200 solder paste, by contrast, is activated as type L0. This activation ensures good wetting combined with a high level of electrical safety on all surfaces used in electronics today. Both solder pastes leave only small amounts of residues after the reflow process, which are bright and transparent and do not have to be removed.

IDEAL TEMPERATURE PROFILES FOR REFLOW SOLDERING

The integration of new solder pastes in established manufacturing processes is usually quite easy and simple. Some cases may require minor modifications to the reflow profile due to board and component configuration. This will ensure the highest possible performance of the flux formulation at minimal adjustments. Easy basic setting can start with 25K above liquidus for 40-60 seconds as the average process window.

This is still is respecting the sensitivity of the majority of components. Following the special conditions in vapour phase equipment, critical components or circuit boards could require a faster or linear profile instead. Please do not hesitate to contact our technical specialists for personal support and optimization purposes.

<p>The main drivers to develop the SP2600 have been the requirement to significantly reduce if not eliminating voiding and avoid solder balling. Even with large area paste deposits or thermal pad bonding the SP2600 proves significant characteristics to exceed the IPC defaults as well as a comfortable process window.</p><p>The halogen free formulation of the REL0 flux convinces in oxygen or nitrogen atmosphere with an uncompromising wetting and printability. To address the enhanced challenges in fine pitch soldering the SP2600 is available in T3 and T4 powder size. Operators with enhanced optical expectations will be more than satisfied with the improved transparency of the residues. To be used in soak and linear profiles our new solder paste is equally effective.</p><p>It is available in TSC305 and silver reduced alloys. SP2600 is qualified for the usage in ramp and linear profiles, but for void reduction we recommend to use a ramp profile with highest possible ramp and peak temperature not exceeding 245°C.</p>
The solder paste SP2600 ensures even with the low activation with a proper wetting activity. It shows low voiding and low solder beading.

NEW SOLDER PASTE SP2600

The main drivers to develop the SP2600 have been the requirement to significantly reduce if not eliminating voiding and avoid solder balling. Even with large area paste deposits or thermal pad bonding the SP2600 proves significant characteristics to exceed the IPC defaults as well as a comfortable process window.

The halogen free formulation of the REL0 flux convinces in oxygen or nitrogen atmosphere with an uncompromising wetting and printability. To address the enhanced challenges in fine pitch soldering the SP2600 is available in T3 and T4 powder size. Operators with enhanced optical expectations will be more than satisfied with the improved transparency of the residues. To be used in soak and linear profiles our new solder paste is equally effective.

It is available in TSC305 and silver reduced alloys. SP2600 is qualified for the usage in ramp and linear profiles, but for void reduction we recommend to use a ramp profile with highest possible ramp and peak temperature not exceeding 245°C.

SP1100 and SP1200 solder pastes are only available with lead containing alloys. These pastes are distinguished by their classification and hence by their different wetting behaviour. While the SP1100 as a highly activated ROM1 solder paste can also achieve good soldering results on surfaces that are difficult to solder, the SP1200 as a ROL1 solder paste is designed for showing best results on good solderable surfaces. The residues of these two No-Clean solder pastes do not have to be removed.

The additional lead containing solder paste, SP15 63S4 allows us to offer solutions to eliminate tombstones. By using combinations of alloys and powder particle sizes in this solder paste, different approaches are selected in order to reduce the number of raised components. The choice of solder paste is only one aspect of removing defects. Layout of the stencil, the pad geometry, solder paste quantity and other manufacturing parameters are just as important to reduce tombstones. Nevertheless, the use of a suitable solder paste can support the safe overall reduction of defects, especially at increasingly smaller components.

For dispensing applications we offer the SP651M solder paste in the lead-free alloy TSC305 (Sn96.5Ag3.0Cu0.5) as a standard product. This solder paste has been designed for reliable automatic dispensing processes with inner dispensing needle diameters down to 0.4mm in particle size 3. The flux medium is classified as ROL0 according to J-STD-004. It is a HalideZero formulation and shows a good process window due to its well-balanced activity. This solder paste leaves only minor amounts of clear and transparent residues.

SOLDER PASTES OVERVIEW

NAME

Alloy

Class 1

Melting Range

Partical Size

Metal Content

Application

GREEN-

CONNECT

SP15

Sn62,8Pb36,8Ag0,4 2

ROL1

179-183°C

3/5 (10-45 µm)

89,5%

Stencil Printing

SP15

Sn62,8Pb36,8Ag0,4 2

ROL1

179-183°C

3/5 (10-45 µm)

89,5%

Stencil Printing

SP1100

Sn62Pb36Ag2

ROM1

179°C

3 (25-45 µm)

90%

Stencil Printing

SP1200

Sn62Pb36Ag2

REL1

179°C

3 (25-45 µm)

90%

Stencil Printing

SP2100

Sn95,5Ag4Cu0,5

REL1

217-223°C

3 (25-45 µm)

88%

Stencil Printing

SP2100

Sn95,5Ag4Cu0,5

REL1

217-223°C

4 (20-38 µm)

88%

Stencil Printing

SP2200

Sn95,5Ag4Cu0,5

REL0

217-223°C

3 (25-45 µm)

89%

Stencil Printing

SP2200

Sn96,5Ag3Cu0,5

REL0

217-220°C

3 (25-45 µm)

89%

Stencil Printing

SP2200

Sn96,5Ag3Cu0,5

REL0

217-220°C

3 (25-45 µm)

89%

Stencil Printing

SP2200

Sn96,5Ag3Cu0,5

REL0

217-220°C

3 (25-45 µm)

89%

Stencil Printing

SP2200

Sn99Ag0,3Cu0,7

REL0

217-227°C

3 (25-45 µm)

89%

Stencil Printing

SP2200

Sn99Ag0,3Cu0,7

REL0

217-227°C

4 (20-38 µm)

89%

Stencil Printing

SP2200

Sn96,5Ag3Cu0,5

REL0

217-220°C

4 (20-38 µm)

89%

Stencil Printing

SP2300

Sn96,5Ag3Cu0,5 4

REL0

217-220°C

5 (15-25 µm)

89%

Stencil Printing

SP2500

Sn96,5Ag3Cu0,5 4

REL0

217-220°C

3 (25-45 µm)

89%

Stencil Printing

SP2500

Sn99Ag0,3Cu0,7

REL0

217-227°C

3 (25-45 µm)

89%

Stencil Printing

SP2500

Sn96,5Ag3Cu0,5 4

REL0

217-220°C

4 (20-38 µm)

89%

Stencil Printing

Solder paste for dispensing

SP651M

Sn96,5Ag3,0Cu0,5

ROL0

217-220°C

3 (25-45 µm)

84%

autom. dispensing

1According to J-STD-004

2Optimized against Tombstone-Effect

3Other packaging sizes are available on request

4Anti-Voiding formulation

We are happy to assist you

If you need any further consultation on which solder wire is right for you, please feel free to contact us.

STANNOL MAIN CATALOGUE

You can find more information on the respective topic and an overview of our product range in our main catalog.