The solder paste SP15 in the alloy 63S4 is a proven anti-tombstone solder paste for lead-frame SMD electronics manufacturing. This solder paste based on an alloy mixture results in the alloy Sn62.8Pb36.8Ag0.4 in the solder joint. The flux medium is classified as ROL1 according to J-STD-004 and as a result shows good activity in combination with a large process window for stencil printing. Due to the use of this special alloy mixture, the defect of tombstoned components after the reflow can be significantly reduced. The low amounts of residues after the reflow are electrically safe and do not have to be removed.
- Special alloy mixture for reduction of tombstoned components
- High printing speeds up to 150 mm/sec possible
- Excellent wetting on OSP
- Reflow possible under air or nitrogen
- Very high wet bonding strength