How to find the right solder paste
Stannol manufactures leaded and lead-free solder pastes in various alloys, grain sizes and packaging for a wide range of applications. Specially developed for lead-free use, we offer silver-containing, silver-reduced and silver-free solder pastes.
Our product selector supports you in your selection: First define your specific area of application in the "Selection guide" section. Then you can select the desired alloy and the appropriate flux properties. Afterwards, the product overview shows you which solder paste is best suited for your area of application.
Stannol Product Selector
The Selector Guide on the left gives you the chance to choose different characteristics and to find a product from our range. If you are not familiar with some of the terms, you can use the information box to display a brief explanation of the selected item.
Selector Guide
Lead-free solder paste SP2200
The No-Clean solder paste SP2200 was developed for use with lead-free alloys in stencil printing. Besides the long open time, this paste shows a good print image directly in the first print even after longer interruptions. The No-Clean solder paste SP2200 is activated after L0. This activation level provides good wetting on all surfaces used in today's electronics while maintaining high electrical safety of the residues. The small amounts of residue after the reflow process are clear transparent and do not need to be removed.
Leaded solder pastes SP1100 and SP1200
The solder pastes SP1100 and SP1200 are only available in lead-containing alloys. These pastes differ in activity and therefore in wetting behaviour. While the SP1100 as a strongly activated ROM1 solder paste can achieve good soldering results even on surfaces that are difficult to solder, the SP1200 as a ROL1 solder paste is rather designed for surfaces that are easier to solder. The residues of both No-Clean solder pastes do not need to be removed.
Anti-Tombstone solder paste SP15 63S4
With the lead-containing solder paste SP15 63S4 we offer a special solution against lifted components (tombstones). With this solder paste, different alloys and grain sizes are mixed so that the number of lifted components can be significantly reduced. However, the right solder paste is only one possible approach to eliminating defects – layout, solder paste quantity and other manufacturing parameters must also be taken into account.
Dispensable solder paste SP651M
For automatic dispensing processes we offer the solder paste SP651M. This solder paste is available in the alloy TSC305 (Sn96,5Ag3,0Cu0,5) in type 3 as standard. This allows reliable and repeatable dispensing in automatic dispensing processes with needle inside diameters up to 0.4 mm. The flux medium of SP651M is classified as ROL0 according to J-STD-004 and is completely halogen-free. Due to its balanced activity, the solder paste has a large process window during reflow soldering and leaves only a small amount of transparent residue.
Optimum solder profiles
Newly developed solder pastes can often be easily integrated into existing processes. Nevertheless, depending on the PCB and component configuration, it may be necessary to make minor changes to the temperature profile in order to achieve the desired performance of the flux. As a good starting point, the middle of the process window at 25 °C for 40 to 60 seconds above the melting point (liquidus) is satisfactory and, for the most part, gentle on the component.
For special requirements, for example in vapour phase systems, with critical components or demanding PCB designs, an accelerated linear profile can also be useful. Please contact us for optimisation – our experienced application engineers will be happy to advise you.
SOLDER PASTES OVERVIEW
NAME | Alloy | Class 1 | Melting Range | Partical Size | Metal Content | Application | GREEN- CONNECT |
SP15 | Sn62,8Pb36,8Ag0,4 2 | ROL1 | 179-183°C | 3/5 (10-45 µm) | 89,5% | Stencil Printing | |
SP15 | Sn62,8Pb36,8Ag0,4 2 | ROL1 | 179-183°C | 3/5 (10-45 µm) | 89,5% | Stencil Printing | |
SP1100 | Sn62Pb36Ag2 | ROM1 | 179°C | 3 (25-45 µm) | 90% | Stencil Printing | |
SP1200 | Sn62Pb36Ag2 | REL1 | 179°C | 3 (25-45 µm) | 90% | Stencil Printing | |
SP2100 | Sn95,5Ag4Cu0,5 | REL1 | 217-223°C | 3 (25-45 µm) | 88% | Stencil Printing | |
SP2100 | Sn95,5Ag4Cu0,5 | REL1 | 217-223°C | 4 (20-38 µm) | 88% | Stencil Printing | |
SP2200 | Sn95,5Ag4Cu0,5 | REL0 | 217-223°C | 3 (25-45 µm) | 89% | Stencil Printing | |
SP2200 | Sn96,5Ag3Cu0,5 | REL0 | 217-220°C | 3 (25-45 µm) | 89% | Stencil Printing | |
SP2200 | Sn96,5Ag3Cu0,5 | REL0 | 217-220°C | 3 (25-45 µm) | 89% | Stencil Printing | |
SP2200 | Sn96,5Ag3Cu0,5 | REL0 | 217-220°C | 3 (25-45 µm) | 89% | Stencil Printing | |
SP2200 | Sn99Ag0,3Cu0,7 | REL0 | 217-227°C | 3 (25-45 µm) | 89% | Stencil Printing | |
SP2200 | Sn99Ag0,3Cu0,7 | REL0 | 217-227°C | 4 (20-38 µm) | 89% | Stencil Printing | |
SP2200 | Sn96,5Ag3Cu0,5 | REL0 | 217-220°C | 4 (20-38 µm) | 89% | Stencil Printing | • |
SP2300 | Sn96,5Ag3Cu0,5 4 | REL0 | 217-220°C | 5 (15-25 µm) | 89% | Stencil Printing | |
SP2500 | Sn96,5Ag3Cu0,5 4 | REL0 | 217-220°C | 3 (25-45 µm) | 89% | Stencil Printing | |
SP2500 | Sn99Ag0,3Cu0,7 | REL0 | 217-227°C | 3 (25-45 µm) | 89% | Stencil Printing | |
SP2500 | Sn96,5Ag3Cu0,5 4 | REL0 | 217-220°C | 4 (20-38 µm) | 89% | Stencil Printing |
Solder paste for dispensing | ||||||
SP651M | Sn96,5Ag3,0Cu0,5 | ROL0 | 217-220°C | 3 (25-45 µm) | 84% | autom. dispensing |
1According to J-STD-004
2Optimized against Tombstone-Effect
3Other packaging sizes are available on request
4Anti-Voiding formulation
We are happy to advise you
If you need further advice on which solder paste is right for you, please feel free to contact us.
STANNOL MAIN CATALOGUE
You can find more information on the respective topic and an overview of our product range in our main catalogue.
