Solder Paste SP2500
Stannol SP2500 is a lead-free No-Clean solder paste that shows exceptionally good wetting behaviour and has a very wide process window for perfect soldering results. The Stannol SP2500 flux system has been specially optimised for lead-free alloys and solder powders with grain size 4, which is also excellently suited for high production throughputs. The formulation shows very good soldering results on a variety of different surfaces and leaves clear residues. Compared to other solder pastes, SP2500 shows a greatly reduced tendency to form voids when processing BGA and QFN components. To minimise the size and number of voids formed, it may be necessary to optimise the temperature profile beyond the recommendation. The solder paste SP2500 is available in the alloy TSC 305 in grain size 4.
Product Advantages
- REL0 classified No-Clean solder paste
- excellent stability of viscosity
- high constant print behaviour
- smallest amounts of clear residues
- perfect wetting with oxygen and nitrogen
- minimal appearance of voids
- anti-capillary effects, in particular at QFP components
- optimised flux system to grain sizes less or equal type 4
Application
The solder paste SP2500 has been developed for stencil printing. The paste can be used in all common open and closed printing systems. The paste is particularly suitable to decrease voiding. Because of the excellent wetting on common surfaces it is suitable for soldering in an air or nitrogen atmosphere.
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