Tin Solder Flowtin TSC305

Tin Solder Flowtin TSC305

Product Characteristics

Description

FLOWTIN TSC305 (Sn96.5Ag3.0Cu0.5) is a lead-free, eutectic solder analogous to ISO 9453:2006 (alloy number 711) with micro-alloyed additives (<0.1%).

The FLOWTIN TSC305 alloy is manufactured from pure metals and has been developed to minimise the disadvantages of conventional lead-free tin/silver/copper alloys regarding dissolution of metals and impurities resulting from these and to guarantee a stable, lead-free soldering process.

Product Advantages

  • Good wetting characteristics
  • Melting range of 217 to 222 °C
  • Improved wetting characteristics, more fine-grained and smoother surface than conventional SnAgCu alloys
  • Reduced dissolution rate in comparison with conventional SnAgCu alloys and as a result significantly increased service lives of the solder baths.
  • Lower cost than eutectic SnAgCu alloy due to 0.8% lower silver content

Application

The use of FLOWTIN TSC305 as wave solder requires a solder bath temperature of approx. 260 to 280 °C. The use of inert gas means a significant extension of the process window. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components. The dross formation is also considerably minimised. FLOWTIN TSC305 can also be used in selective soldering systems.