Tin Solder FLOWTIN TC

Tin Solder FLOWTIN TC

Product Characteristics

Description

FLOWTIN TC (Sn99Cu1 and Sn99.3Cu0.7) is a lead-free, eutectic solder analogous to ISO 9453:2006 (alloy number 401) with micro-alloyed additives (<0.1%). The FLOWTIN TC alloy is manufactured from pure metals and has been developed to minimise the disadvantages of conventional lead-free tin/copper alloys regarding dissolution of metals and impurities resulting from these and to guarantee a stable, lead-free soldering process.

Product Advantages

  • Eutectic alloy (defined melting point at 227 °C)
  • Good wetting characteristics
  • More finely grained and smoother surface than conventional Sn99Cu1 alloys
  • Reduced dissolution rate in comparison with conventional Sn99Cu1 alloys and as a result significantly increased service lives of the solder baths.

Application

The use of FLOWTIN TC as wave solder requires a solder bath temperature of approx. 260 to 280 °C. The use of inert gas means a significant extension of the process window. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components. The dross formation is also considerably minimised. FLOWTIN TC can also be used in selective soldering systems.