FLOWTIN TC300 (Sn97C3.0) is a lead-free solder analogous to ISO 9453:2006 (alloy number 402) with micro-alloyed additives (<0.1%).
The alloy is manufactured from pure metals and has been developed to minimise the disadvantages with lead-free high-temperature soldering of conventional lead-free tin/copper alloys regarding dissolution of metals and impurities resulting from these and to guarantee a stable, lead-free soldering process.
- Good wetting behaviour
- Melting range of 227 to 310 °C
- Fine-grained and smooth surface
- Reduced dissolution rate in comparison with conventional SnCu alloys and as a result significantly increased service lives of the solder baths.
- Longer contact times possible
The use of FLOWTIN TC300 requires a solder bath temperature > 350 °C. Due to the high dissolution rate of copper, there is the risk here that the liquid temperature of the solder increases greatly and that thin wires and layers are dissolved in a short time. FLOWTIN TC300 reduces the dissolution rate and thus prevents the reduction of the Cu cross section of the wire. If occurring dross presents a problem, lead-free deoxidation pellets can be added to keep the surface bare. The use of inert gas means a significant extension of the process window. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components. The dross formation is also considerably minimised. FLOWTIN TC300 can also be used in selective soldering systems.