ECOLOY TSC305 (Sn96.5Ag3.0Cu0.5) is a lead-free solder according to ISO 9453:2006 (alloy number 711) which can replace eutectic or almost eutectic tin/lead or tin/lead/silver alloys.
The ECOLOY TSC305 alloy is manufactured from pure metals and has been developed to eliminate the use of tin/lead alloys in all existing production processes in electronics manufacturing and guarantees a lead-free soldering process.
- Good wetting characteristics
- Melting range of 217 to 222°C
- Longer service life due to reduced copper content
- Lower cost than eutectic SnAgCu alloy due to 0.8% lower silver content