Tin Solder ECOLOY TSC305

Tin Solder ECOLOY TSC305

Product Characteristics


ECOLOY TSC305 (Sn96.5Ag3.0Cu0.5) is a lead-free solder according to ISO 9453:2006 (alloy number 711) which can replace eutectic or almost eutectic tin/lead or tin/lead/silver alloys.

The ECOLOY TSC305 alloy is manufactured from pure metals and has been developed to eliminate the use of tin/lead alloys in all existing production processes in electronics manufacturing and guarantees a lead-free soldering process.

Product Advantages

  • Good wetting characteristics
  • Melting range of 217 to 222°C
  • Longer service life due to reduced copper content
  • Lower cost than eutectic SnAgCu alloy due to 0.8% lower silver content


The use of ECOLOY TSC305 as wave solder requires a solder bath temperature of approx. 260 to 265°C. The use of inert gas means a significant extension of the process window. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components. ECOLOY TSC305 can also be used in selective soldering systems.