ECOLOY TSC263 (Sn97.1.5Ag2.6Cu0.3) is a lead-free solder according to ISO 9453:2006 which can replace eutectic or almost eutectic tin/lead or tin/lead/silver alloys.
The alloy is manufactured from pure metals and has been developed to eliminate the use of tin/lead alloys in all existing production processes in electronics manufacturing and guarantees a lead-free soldering process.
ECOLOY TSC263 is free of patents and the manufactured products are free of claims concerning the solder composition. Even if the copper content increases as is usual for wave soldering, no solder joints are produced which infringe patent claims.
- Good wetting behaviour
- Melting range of 217 to 224 °C
- Characteristics comparable with ECOLOY TSC305
- Longer service life due to reduced copper content
- Lower cost than eutectic SnAgCu alloy due to 1-2% lower silver content