Tin Solder ECOLOY TSC263

Tin Solder ECOLOY TSC263

Product Characteristics


ECOLOY TSC263 (Sn97.1.5Ag2.6Cu0.3) is a lead-free solder according to ISO 9453:2006  which can replace eutectic or almost eutectic tin/lead or tin/lead/silver alloys.

The alloy is manufactured from pure metals and has been developed to eliminate the use of tin/lead alloys in all existing production processes in electronics manufacturing and guarantees a lead-free soldering process.  

ECOLOY TSC263 is free of patents and the manufactured products are free of claims concerning the solder composition. Even if the copper content increases as is usual for wave soldering, no solder joints are produced which infringe patent claims.

Product Advantages

  • Good wetting behaviour
  • Melting range of 217 to 224 °C
  • Characteristics comparable with ECOLOY TSC305
  • Longer service life due to reduced copper content
  • Lower cost than eutectic SnAgCu alloy due to 1-2% lower silver content


The use of ECOLOY TSC263 as wave solder requires a solder bath temperature of approx. 260 to 265°C. The use of inert gas means a significant extension of the process window. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components. ECOLOY TSC263 can also be used in selective soldering systems.