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SP6000 TBS04

The solder paste SP6000 TBS04 is part of Stannol’s sustainable greenconnect product line. What makes it special: This solder paste enables about 85 percent CO2 emissions savings compared to conventional solder pastes, primarily due to the use of recycled solder. The TBS04 alloy (Bi57.6Sn42Ag0.4) is a low-melting solder alloy with a melting range of 138–140 °C.
SP6000 TBS04

Product Advantages

  • solder powder from recycled solder
  • about 85 % CO2 savings
  • low melting point
  • suitable for fine-pitch down to 0.4 mm
  • excellent print definition after longer printer downtime
  • reflow soldering possible in air or nitrogen
  • excellent wetting on most surfaces
  • RoHS compliant

Application

Paste printing: The solder paste was developed for stencil printing. SP6000 TBS04 with particle size type 4 (20–38 µm) is suitable for all common open and closed printing systems.

 

Cleaner

Pre soldering: cleaner Flux-Ex Pre

After soldering: cleaner Flux-Ex Post</

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