Selector Guide

Application

Operative Range

After choosing the operative range, you can make a more detailed selection of your requirements. You can select various surfaces of your solder goods such as stainless steel or aluminium as well as the classic application areas in electronics manufacturing such as manual or repair soldering.

Application

The application area of soldering wires for soft soldering is very diverse. After the rough application selection in the upper field, the selection can be further limited here in the direction of the soldering task to be performed. Here, you can set both various surfaces of your solder material such as stainless steel or aluminium as well as the classic application areas in electronics manufacture such as manual soldering or repair soldering. This preselection depends on the selection in the "Application" field and enables a specific limitation of the following search parameters.

Alloy

Lead-free

The use of lead containing solder is severely restricted by legislation in the electronics manufacturing. Lead containing solder is still allowed in some application areas. It is permitted in the DIY sector if the soldered product is either not electronics or the electronics are not brought into the market, too.

Alloy Composition

The solders are characterised by different metal compositions. The alloy composition describes the proportions in which the metals are present in the alloy. As a result, physical basic data of the alloy such as strength, melting point and similar are defined.

DIN ISO 9453

The standard ISO 9453 defines which amount of impurities is permitted to be present in the alloys. 

Melting range

Various alloys are eutectic; these show a defined melting point. Other alloys only show a melting range. This is dependent on the composition of the alloy. For non-eutectic alloys with a melting range, the lower value indicates the solidus point; the solder is solidified below this temperature. The upper value indicates the liquidus temperature; the solder is completely liquid above this temperature. In between these temperatures, the solder is paste-like. 

Special Requirements

INCREASED SOLDERING TIP SERVICE LIFE

The lead-free solders not only dissolve the copper quicker than the lead containing solders do. Also the iron, which is the wettable surface of a soldering tip, is dissolved faster. This reduces the life time of the soldering tip significantly. The dissolution rate of the iron can be significantly reduced by the addition of micro-alloying elements. For this reason we developed the micro-alloying FLOWTIN series.  Depending on the application, an increase in the life time of soldering tips of 10 to 50% is possible.

Flux Spitting

As a flux inside a solder wire is solid at room temperature and liquid at soldering temperature, it changes its properties while heating up the solder wire. The vapour pressure inside the solder wire will increase. This depends on the temperature, alloy and flux composition. If the solder wire is heated up, from 80-140°C the flux will get liquid and start building up pressure. A short time later the metal gets liquid and the pressure can be released, the flux will spit to some undefined area around the solder joint and on the soldering equipment. The behaviour of each flux type is different and with new developments of solder wires the flux spitting is highly reduced, compared with some older, well established products. The newer products are mentioned to be “Low Spitting” or “Very Low Spitting” solder wires.

Cost Reduction

The life time of soldering tips can be increased by the use of micro-alloying elements in the solder. These are the solders of our FLOWTIN series. The extended life time means lower costs for new soldering tips.

Reduction of the silver content in the solder is also a good possibility to reduce costs. Alloys without silver based on tin/copper as well as alloys with only 0.3 or 2.6% silver are worth considering.

Flux Characteristics

Flux

Flux containing solder wires are also called cored solder wires. The flux prepares the metal surface for the wetting of the solder. "Solid wires" and "flux-filled wires" can be selected.

Activation

Activation describes the capability of removing the existing oxide layer prior to wetting. The higher the activation, the better the wetting and spreading of the solder.  The activation levels "High", "Medium" and "Low" can be selected.

Cleaning

Sometimes the flux residues must be cleaned after soldering to increase the electric reliability. The recommend cleaning method can be found in the data sheets of the products.

You can choose "Necessary" or "No-Clean" as possible selection criteria. No-Clean solder wires leave electrically safe residues which can remain on the assembly.

Residues

After the soldering process, there are often flux residues around the solder joint. Depending on the type of flux and the soldering process used, the amounts of flux residues are quite different. Whether the residues can remain at the solder joint or not, is determined by the electrical safety of the residues. Some of the fluxes are leaving corrosive residues which have to be removed after soldering. These fluxes are not suitable for electronic applications. 

Flux Content

The proportion of the solid flux in the wire is stated as percentage by weight for the solder wires. The flux content is adapted to the activity of the flux so that reliable solderability is always guaranteed. If the flux content is a search criterion, for example to reduce the residue amounts, you can search for a specific value.

Halide Content

If a flux contains halides, it is usually higher activated than a halide-free flux. Halide activated fluxes usually show better wetting characteristics. If the halide content is a search criterion, it can be specified here.

Flux J-STD-004

The standard J-STD-004 classifies fluxes according to their type and activity.  

Flux Standard DIN EN 29454-1

The standard DIN EN 29454-1 classifies the fluxes for soft soldering according to their ingredients. Flux type, flux base, flux activator and flux quality such as 2.1.3 A are taken into account here.

Flux Standard DIN 8511

The standard DIN 8511 is an obsolete standard which classifies the fluxes according to the F-SW classes (F-SW = flux-heavy metals-soft soldering). These classes are oriented both to the recipe ingredients of the fluxes as well as to the corrosivity of the residues after soldering. The designations according to this standard are no longer usual today even if still familiar as F-SW26 or F-SW32.

Cores

The flux is injected into the solder wire during production. Depending on the flux type and alloy, versions with one or more flux cores are available. 

Avaible Delivery Forms

Wire Diameter

The solder wires are manufactured in various diameters. According to the different standards, the diameter of the solder wire is permitted to have a specified manufacturing tolerance. However, Stannol only manufactures all wires with the negative tolerance so that there are no problems with the internal diameters of the wire feeders, particularly for an automated feeding mechanism and feed of the wire to the soldering tip.

Reel Size

The solder wires are wound on various reel sizes. The sizes 100 g to 1000 g are selected here as standard. However, we also manufacture solder wires in special sizes of 2.5 kg to 20 kg. 

Info

The Selector Guide on the left gives you the chance to choose different characteristics and to find a product from our range.

If you are not familiar with some of the terms, you can use the information box to display a brief explanation of the selected item.

On the right side you find a product overview of our product range. Products which do not meet the selected characteristics are shown brightened and you cannot choose them any longer.

The reset button deletes your input back to the starting position.

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