SOLDER PASTE SP2400

SOLDER PASTE SP2400

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Alloy Composition

The solders are characterised by different metal compositions. The alloy composition describes the proportions in which the metals are present in the alloy. As a result, physical basic data of the alloy such as strength, melting point and similar are defined.

Container

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Product Characteristics

SOLDER PASTE SP2400

Description

The solder paste SP2400 has been developed for the high volume, lead-free SMD electronics manufacturing. The solder paste is characterized by less voiding. The long open times and the high printability have a positive effect on the soldering result. With a special formula for excellent wetting, it meets the requirements for wetting on the surfaces which can be found today in every series manufacturing process.

The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.

Product Advantages

  • Less voiding
  • Reflow under air and nitrogen atmosphere possible
  • Long open times of the paste
  • No-Clean
  • Less residues, good electrical safety
  • Stable printing characteristics

Application

The solder paste SP2400 has been developed for stencil printing. The paste can be used in all common open and closed printing systems. The paste is particularly suitable to decrease voiding. Because of the excellent wetting on common surfaces it is suitable for soldering in an air or nitrogen atmosphere
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