SOLDER PASTE SP2400
The solder paste SP2400 has been developed for the high volume, lead-free SMD electronics manufacturing. The solder paste is characterized by less voiding. The long open times and the high printability have a positive effect on the soldering result. With a special formula for excellent wetting, it meets the requirements for wetting on the surfaces which can be found today in every series manufacturing process.
The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.
- Less voiding
- Reflow under air and nitrogen atmosphere possible
- Long open times of the paste
- Less residues, good electrical safety
- Stable printing characteristics