Selector Guide


Lötverfahren Test

Bei den Lötverfahren unterscheidet man verschiedene Verfahren. Wellenlöten, Reflowlöten, Selektivlöten, Tauchlöten, Roboterlöten und Handlöten. Alle Verfahren werden je nach Lötaufgabe separat eingesetzt und können meist auch problemlos miteinander kombiniert werden.


Nitrogen is used for various soldering processes to remove oxygen during the soldering process and thus keep the oxide formation (dross) as low as possible during the soldering. Nitrogen is particularly used for wave, reflow and selective soldering, partially also for manual soldering around the soldering tip.

Working temperatures

If the soldering task requires specific temperatures such as burning off enamelled copper wires, you can preselect this temperature here. Soft soldering is usually only performed up to temperatures of 450 °C. 



The use of lead containing solder is severely restricted by legislation in the electronics manufacturing. Lead containing solder is still allowed in some application areas. It is permitted in the DIY sector if the soldered product is either not electronics or the electronics are not brought into the market, too.

Alloy Composition

The solders are characterised by different metal compositions. The alloy composition describes the proportions in which the metals are present in the alloy. As a result, physical basic data of the alloy such as strength, melting point and similar are defined.

DIN ISO 9453

The standard ISO 9453 defines which amount of impurities is permitted to be present in the alloys. 

Melting range

Various alloys are eutectic; these show a defined melting point. Other alloys only show a melting range. This is dependent on the composition of the alloy. For non-eutectic alloys with a melting range, the lower value indicates the solidus point; the solder is solidified below this temperature. The upper value indicates the liquidus temperature; the solder is completely liquid above this temperature. In between these temperatures, the solder is paste-like. 

Special Requirements


During the soldering process, the lead-free solders dissolve the copper quicker than lead containing solders do. The dissolution rate (speed of the copper dissolution and enrichment) can be significantly reduced by adding micro-alloying elements like in our FLOWTIN solders, which are developed for this purpose. 

reduced dross formation

In areas where solder is kept liquid over a long time, tin together with the oxygen in the air forms very quickly tin oxide (called dross) on the surface of the liquid solder. Dross formation particularly occurs in the area of wave and selective soldering. Certain micro-alloying elements which can be added to the solder are suitable for reducing the amount of dross and finally cost. 

Costs Reduction

The amount of dross produced in the solder bath is reduced by the use of micro-alloying elements in the solder for wave and selective soldering machines. As a result, less dross has to be skimmed off which has the benefit that less solder is lost.

This results in less solder being refilled.

Reduction of the silver content in the solder is also a good possibility to reduce costs. Alloys without silver, based on tin/copper as well as alloys with only 0.3 or 2.6% silver are worth considering. 

Avaible Delivery Forms

Form Factor

The solders are cast in certain forms. Using the form factor, the different casting forms such as triangular bar, kilo bar or ingots with hanger holes can be selected.


If you select the form, the dimensions are displayed.


The Selector Guide on the left gives you the chance to choose different characteristics and to find a product from our range.

If you are not familiar with some of the terms, you can use the information box to display a brief explanation of the selected item.

On the right side you find a product overview of our product range. Products which do not meet the selected characteristics are shown brightened and you cannot choose them any longer.

The reset button deletes your input back to the starting position.