Selector Guide

Application

Application

There is a large variety of applications for our different kind of fluxes. Different application areas such as electronics, PCBs and tinning as well as many different surfaces such as copper, steel and iron are selectable.

Application Method

Application method means how a flux is applied. In addition to the common application methods like spray and foam fluxing, there are also dipping and dispensing. Manual application using a brush and drip application are also possible.

Soldering Method

Wave, selective and dip soldering are common methods used for the flux. As each method has specific requirements, the characteristics of the flux must be adjusted accordingly, e.g. the solid content, the amount or type of solvents or activators.

Nitrogen

Nitrogen is used for various soldering processes to remove oxygen during the soldering process and thus keep the oxide formation (dross) as low as possible during the soldering. Nitrogen is particularly used for wave, reflow and selective soldering, partially also for manual soldering around the soldering tip.

Lead-free

The use of lead containing solder is severely restricted by legislation in the electronics manufacturing. Lead containing solder is still allowed in some application areas. It is permitted in the DIY sector if the soldered product is either not electronics or the electronics are not brought into the market, too.

Flux Characteristics

Activation

Activation describes the capability of removing the existing oxide layer prior to wetting. The higher the activation, the better the wetting and spreading of the solder.  The activation levels "High", "Medium" and "Low" can be selected.

Flux base

The flux is based on solvents like alcohol and water.

Cleaning

If a highly activated flux is used for soldering, the flux residues in certain circumstances must be cleaned after the soldering. If this is not done, corrosion at and around the solder point can occur in the short or long term. It can be selected here whether cleaning is required or not. The respective cleaning variant can be found in the data sheets for the respective products.

You can set "Necessary" or "No-Clean" as possible selection criteria. No-Clean fluxes leave electrically safe residues which can usually remain on the assembly.

Halogenated

If a flux contains halogens, it is usually higher activated than a halogen-free flux. Activated fluxes containing halogens are usually distinguished during the soldering process by better wetting. Halogen-free fluxes and their residues are usually considered as significantly less susceptible to corrosion on the solder product. This is usually only correct at first glance. The general conditions must always be considered precisely for the "Halogenated Yes/No" question. Many soldering methods do not need any halogenated activators; for some solder processes, this activator group is very helpful or even makes soft soldering possible at all.

Solid Content

The solid content mainly specifies the proportion of solid components. In addition to the active solder substances, there are also other additives which positively influence the characteristics of the respective flux.

Flux J-STD-004

The standard J-STD-004 classifies fluxes according to their type and activity.  

DIN EN 61190-1

The standard DIN EN 61190-1 to 3 classifies fluxes according to their type and activity. For example, the fluxes are designated as ROL0 or REL1. For the electrical industry, it is also assessed afterwards which influence the flux residue has on the fitness for purpose of the assembly. The difference from the standard J-STD-004 consists of the amount of halogens permitted to be contained in the flux.

Flux Standard DIN EN 29454-1

The standard DIN EN 29454-1 classifies the fluxes for soft soldering according to their ingredients. Flux type, flux base, flux activator and flux quality such as 2.1.3 A are taken into account here.

Resin Content

A higher resin content increases the surface insulation resistance; the residues are electrically safer; the risk of corrosion is minimised. Resin content in fluxes also reduces the formation of solder beads. On the other hand, it should be noted that the amount of residue is also increased with higher resin contents. However, this is often only a cosmetic aspect which has no influence on the reliability of the assembly but very probably on the suitability for further processing such as painting. The "High", "Medium", "Low" and "Resin-free" criteria can be selected here.

Avaible Delivery Forms

Container

The item "Container" shows which packaging size is available for this product.

Info

The Selector Guide on the left gives you the chance to choose different characteristics and to find a product from our range.

If you are not familiar with some of the terms, you can use the information box to display a brief explanation of the selected item.

On the right side you find a product overview of our product range. Products which do not meet the selected characteristics are shown brightened and you cannot choose them any longer.

The reset button deletes your input back to the starting position.

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